Quality Assurance Processes
Spec #: ANSI / IPC-610
Title: Acceptability of Electronics Assembly
Approved Class:
Class 1, 2 & 3
Spec #: MIL-STD-2000
Title: Military Standard Requirements for Soldered Electronic Assemblies
Spec #: MIL-STD-883
Title: Military Standards Test Methods and Procedures for Microelectronics
Approved Test Methods:
Method 1014 Seal Test (Fine Leak "A1" and Gross Leak "C1")
Method 2003 Solderability Testing
Method 2009 External Visual Inspection
Method 2015 Resistance to solvents
Spec #: MIL-M-38510
Title: Military Specification Microcircuits, Digital, Highspeed, CMOS, Buss
Transceivers with Three-State Outputs, Monolithic Silicon
Approved Sections:
Quality Assurance Program
Soldercoat Lead Finish
Spec #: MIL-PRF-38535 / MIL-I-38535
Title: Performance Specification for Integrated Circuits (Microcircuits)
Manufacturing,General Specifications
Approved Sections:
Quality Assurance Program
Soldercoat Lead Finish
Spec #: MIL-S-19500
Title: Military Specification Semiconductor Devices General Specifications
Approved Sections:
Quality Assurance Program
Soldercoat Lead Finish
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